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Supermicro Direct Liquid Cooling Service Associate (SDLCSA) Exam Sample Questions (Q34-Q39):

NEW QUESTION # 34
Where in the chassis are the internal fans and fan housing located?

A. In the middle of the PCIe tray
B. In the back of the motherboard tray
C. In the back of the PCIe tray
D. In the middle of the motherboard tray

Answer: D

Explanation:
In Supermicro systems like the SYS-421GE-TNHR2-LCC, internal fans and their housing are typically located in themiddle of the motherboard tray, providing airflow across CPUs and memory, even in DLC setups where liquid cooling handles primary heat removal. This placement, seen in similar systems (e.g., SYS-
420GP-TNAR), balances cooling distribution. A and B (PCIe tray) focus on GPU cooling, not motherboard fans, while C (back of motherboard tray) is less common due to PSU placement. Supermicro's DLC hybrid designs integrate fans centrally on the motherboard tray, making D correct.References:Supermicro chassis layouts, DLC hybrid cooling configurations.

NEW QUESTION # 35
How many screws need to be removed from the metal bracket that holds down the LPIO board / BMC cable?

A. 0
B. 1
C. 2
D. 3

Answer: A

Explanation:
The LPIO (Low-Profile IO) board and BMC cable in Supermicro systems are typically secured by a minimal number of screws for quick serviceability, a principle in DLC designs like the SYS-421GE-TNHR2-LCC.
Based on similar systems (e.g., SYS-420GP-TNAR), the metal bracket holding these components is fastened with 2 screws, balancing security and ease of access. Higher counts like 8 (A), 5 (B), or 6 (D) are excessive for a small bracket, while 2 (C) matches Supermicro's standard for IO-related brackets. In DLC contexts, modularity is key, supporting C as the verified number.
References: Supermicro IO board installation guides, DLC system service efficiency.

NEW QUESTION # 36
What design feature helps to align the air shroud back into the motherboard tray?

A. There are 2 tabs on front of the air shroud that should align with 2 slots on top of the fan board
B. There are 4 tabs on front of the air shroud that should align with 4 slots on top of the fan board
C. There are 2 tabs on the sides of the air shroud that should align with 2 slots on top of the PCIe board
D. There are 3 tabs on front of the air shroud that should align with 3 slots on top of the fan board

Answer: D

Explanation:
In Supermicro systems, the air shroud aligns with the motherboard tray via tabs and slots. The correct feature is3 tabs on the front of the air shroud aligning with 3 slots on top of the fan board, a common design (e.
g., SYS-420GP-TNAR) for precise placement over fans and CPUs. B (4 tabs) and C (2 tabs) deviate from standard counts, while D (PCIe board) misplaces the alignment. Supermicro's DLC hybrid cooling ensures shroud accuracy, making A correct.References:Supermicro air shroud installation guides, DLC system cooling alignment.

NEW QUESTION # 37
What are the full steps and proper order for removing the LPIO board from the PCIe tray?

A. Remove metal bracket holding down LPIO board > Remove PCIe air shroud > Remove internal fans
B. Remove PCIe air shroud > Remove all AOC NIC cards > Remove metal bracket holding down LPIO board
C. Remove GPU > Remove metal bracket holding down LPIO board > Remove 3 or 4 AOC NIC cards
D. Remove a few AOC NIC cards > Remove PCIe tray > Remove motherboard tray

Answer: B

Explanation:
Removing the LPIO (Low-Profile IO) board from the PCIe tray in the SYS-421GE-TNHR2-LCCinvolves:
* Remove PCIe air shroud: Clears access to components (standard in Supermicro designs).
* Remove all AOC NIC cards: Disconnects cards on the LPIO board for unobstructed removal.
* Remove metal bracket holding down LPIO board: Unscrews (typically 2 screws) the bracket securing the board.Option B follows Supermicro's logical service order (e.g., SYS-420GP-TNAR), ensuring safe access in DLC systems. A (GPU) is unrelated, C (tray removals) is excessive, and D (fans) is irrelevant. B aligns with Supermicro's DLC modularity, making it correct.References:
Supermicro PCIe tray service guides, DLC system IO removal protocols.

NEW QUESTION # 38
Which type of Liquid Cooling is discussed in this training?

A. Rear Door Heat Exchanger (RDHx)
B. Direct to Chip (DLC)
C. Immersion Cooling (ILC)
D. Evaporative Cooling

Answer: B

Explanation:
The training focuses on Supermicro'sDirect to Chip (DLC)liquid cooling, as indicated by the context of SYS-
421GE-TNHR2-LCC and Supermicro's expertise in DLC solutions (e.g., cold plates, CDUs up to 100kW).
DLC circulates coolant directly to CPUs/GPUs, reducing OPEX by 40% and supporting high-density racks. A (RDHx) cools via rear doors, B (Evaporative) uses evaporation, and C (ILC) submerges servers-none match Supermicro's DLC emphasis here. D is the verified type.References:Supermicro DLC whitepapers, SYS-
421GE-TNHR2-LCC cooling specs.

NEW QUESTION # 39
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Useful Well SDLCSA Prep - Win Your Supermicro Certificate with Top Score

The Benefits of Using Desktop Supermicro SDLCSA Practice Test Software

Supermicro Direct Liquid Cooling Service Associate (SDLCSA) Exam Sample Questions (Q34-Q39):

Free PDF SDLCSA - Supermicro Direct Liquid Cooling Service Associate (SDLCSA) Exam –Reliable Well Prep

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